There is more or less heat generated inside all electronic products we use in the operation process. The heat discharge of some products not in time may impact the normal use of the and even cause overburning of the components and parts and more losses. Although all know that "heat" is a normal phenomenon, sometimes they feel troubled.
As a heat source of the computers we used, the immediacy of heat dissipation the mainboard in the field of DIY has attracted considerable interest of DIY players. Although the improvement of chip manufacturing process and application of new technologies  make the quantity of heat of chip of the mainboard lower, the it is necessary to attach importance to the heat dissipation of the mainboard absolutely for the stable operation of the platform inside the relatively closed chassis.
There are many products for heat dissipation of the mainboard in the stores now and various accessories also overwhelm the DIY players. There are special cold heads and accessories designed for the mainboard in not only the conventional entry-level and mainstream markets, but also the high-end DIY field.
Some mainstream flagship mainboard are also designed with original blocks
Currently, many mainboard products on the market are provided with blocks at the time of ex-factory and the inside passage has been designed. The excellent heat dissipation design not only makes the mainboard look more beautiful but also bring the excess heat of the mainboard effectively. The design quality of heat dissipation is a way to measure the strength of a mainboard manufacturer. Although the cost is somewhat high but many high-end players has less trouble then.
From original windrow to the simple integration now
In recent years, high-tech technologies and production process have been applied to the mainboard. Similar to the processor, the process of current mainboard radiator has been advanced constantly, which in fact makes the effect heat radiation design reduced. Of course, we are not willing to see the bare mainboard; But it is undeniable that the mainboard radiator has been simplified gradually in recent years. It is no longer the various anencephalous windrows in previous years and some heat dissipation technology is the key. 
Supervisory chip is the heat source
At current, the CS(chipset) of Intel mainboard ha sadopted the single chip design so we can often find that the low-end mainboard of Intel chipset is very "stingy" in the material of radiator. Several small heat sinks can meet the heat dissipation requirements of the mainboard, which however, reflects that chipset has small quantity of heat andthe mainboard has less demand of the  heat dissipation than a few years ago.
The polyphasesupply is one of the larger heat sources
In the mainboard market few years ago, the heat dissipation of power supply module is divided into two groups. The low-end group is not provided with any heat sinks on the power supply module and the bare appearance make people bitterly disappointed. While the other high-end group overuses the heat dissipation and is provided with various radiators with smart design. People feel confused about the contrast  and this kind of "bare crystal" can be taken as a try.
A few years ago, some powerful chips maybe require the independent heat dissipation. For example, the ships like "PLX PEX8747" require the heat sinks for the stable operation. It seems that many mainboards are equipped with heat-dissipating devices in these parts since the Z87 era, which maybe is for the more stable machine or is because the change of a chip can cause big change in the heat dissipation layout of the entire mainboard!
Changes of the times lead to changes of overall heat dissipation demand
In the early DIY mainboard market, many mainboard heat sinks may strange and multitudinous and the main manufacturers also launch special heat dissipation products for the different types of mainboards. It can be found from the careful summarization that in fact the heat dissipation design of the mainboard is consistent with the certain specifications and principles, which is also the basis for ensuring the heat dissipation efficiency and the elegant appearance of the heat sinks.
We could found these small fans in the I/O function area from many mainboard heat dissipation kits in the market few years ago and there are many products with such heat dissipation concept. The mainboard installed in the chassis will have the wind tunnel composed by a small fan, which gave good effect and design concept at that time.
However, the fans of these products blew to the inside but can not act as an "exhaust fan". They shall blow outside instead of inside to compose the wind tunnel with the inside of chassis. Now there is design that this is the prepared hole for the I/O function area so the DIY players can install small fans by themselves.
The original layout of the mainboard and the selection of heat dissipation products now seems terrible
In terms of the shape of the heat sink, since the it is necessary to increase the contact area between the heat sink and the air to dissipate the heat of the heat sink better then we can see that most of the heat sinks of the mainboard are in fin shape, which can increase the heat dissipation area under the condition of limited materials and is very practical.
The heat dissipation kits for these mainboard were common a few years ago.
The heat pipes were very commonly used in mainstream mainboard products a few years ago. Quite apart from the fact that how high the heat transfer efficiency of the heat pipe can be and the way connecting the power supply module and the south bridge in series is very appealing. The heat sinks in different areas connected by heat pipes can dissipate heat from hot area to other areas to play the role of supplemental heat dissipation. The match of fins with heat pipes now are used in almost all mainstream air-cooling heat dissipation devices and the effect is very good.
The mainboard heat dissipation kits in today's market seem to be more and more "regular"
Development of technology so far, we can also see more extreme heat dissipation methods on some flagship mainboards. However, with the changes in the DIY era, the heat dissipation kits in today's mainboard market seem to be more and more "regular" and you can see that the ATX mainboards for Z87 almost choose the similar kits for the heat dissipation of north and south bridges and chips. The manufacturer are gradually exploring the high-tech content of the product and there are not so much windrows now for the mainboards like few years ago. The conventional original heat dissipation is enough.
Both radiator and chassis impact the heat dissipation of mainboard 
In addition to the heat dissipation design of the mainboard itself, the heat dissipation pattern of the processor's radiator will also directly affect the ambient temperature. At present, the radiators are mainly divided into the downward type and the side blowing type. The downward type can involve the heat dissipation around the processor, while the side blowing type can make the wind tunnel inside the chassis more perfect.
The traditional downward radiator has the supplemental heat dissipation function for the mainboard.
We recommend that theentry level users consider the downward radiator, then the processor radiator can make up for the deficiency of the dissatisfactory mainboard radiator design. The high-end platforms can choose the radiator they need, such as higher-end tower radiator or integrated water-cooled radiator. One with ideas and hands-on skills can choose the integrated water-cooled radiator.
Inverted 38 degree chassis architecture
The side of the chassis also changes greatly from the  "RTX inverted 38 degree" architecture few years ago to the "DTX" split architecture newly presented this year and the ultimate goal of these changes is "heat dissipation" only. The expensive core hardwarecan't be separated with a comfortable "home."
The so-called "matching products" for DIY players like radiators and chassis also have changed a lot in recent years and they are not the supporting parts in the DIY field. We all know that the price for a high-quality radiator or flagship chassis product is already much higher than a mid-to-high-end CPU processor. Its share in the DIY configuration is also increasing. It is amazing but a truth too. The heat dissipation of the board is also inseparable from these so-called "supporting products"!
Different configurations have different heat dissipation requirements
Now, the performance and specifications of the mainboard are getting better and better and the process has been constantly improved and innovated. The heat sinks such as north and south bridges and chips in the mainboard can basically achieve the functions should have. The improvement of the process and the continuous reduction of power consumption make the seemingly thin passive heat sinks meet the heat dissipation performance of current mainstream products. The original designs for the mainborad are enough for the general mainstream DIY player or game player but it is another thing for the overclockers or high-end MOD authors who require stability and consider the visual shock at the same time.
Words in the end:
In fact, no matter how the radiators are designed, our ultimate goal is to dissipate heat from the inside of the chassis! Due to the different platform configuration and design, all need to know how to solve the heat dissipation problem of their own platform. Therefore this paper is more to lead everyone to learn about the eat dissipation of the mainborad. All players shall consider the heat dissipation performance of the platform themselves and carefully take the other supporting components into account.